Opto-Electronics Glass

OPTO-ELECTRONICS GLASSES

Anodic Bonding Glass (SD2)

The thermal expansion characteristics are matched with silicon single crystal. Therefore, anodic bonding with little distortion can be performed over a wide temperature range.

Features

  1. Matching thermal expansion characteristics with silicon single crystal
    By selecting the glass composition of aluminosilicate type (SiO2-Al2O3-Na2O type), thermal expansion was matched with silicon single crystal over wide temperature range.
  2. Easy anodic bonding
    The volume resistivity is reduced by adding a small amount of Na, and it has become glass composition that can perform strong bonding even at temperatures of 400 °C or lower.
  3. Stable quality
    The variation in the thermal expansion characteristics between the production lots is very small and stable.
  4. Good to process
    It can be etched with low concentration hydrofluoric acid aqueous solution, and the etched surface becomes mirror surface.

Example of Application

  • 1) Semiconductor pressure sensor substrate
  • 2) Acceleration sensor substrate
  • 3) Nozzle part of ink jet printer
  • 4) Glass for micromachining bonding

Characteristic

Item Unit SD2 Remarks
Thermal Properties
Coefficient of Thermal Expansion X10-7/℃ 32 30~300 ºC (thermal expansion meter)
X10-7/℃ 33 30~350 ºC (thermal expansion meter)
X10-7/℃ 34 30~400 ºC (thermal expansion meter)
X10-7/℃ 35 30~450 ºC (thermal expansion meter)
X10-7/℃ 36 30~500 ºC (thermal expansion meter)
Strain Point ºC 670 1014.5poise
Transformation (Tg) ºC 720
Sag Point (Ts) ºC 785
Mechanical Properties
Specific Gravity 2.60
Young’s Modulus GPa 87
Modulus of Rigidity GPa 35
Poisson’s Ratio 0.24
Knoop Hardness   638
Abrasion Factor 44
Chemical Resistance
HN03 Resistance mg/cm2 0.08 *1
H2S04 Resistance mg/cm2 <0.01 *2
NaOH Resistance mg/cm2 <0.01 *3
Optical Properties
Reflective
Index
(Nd) 1.531
Abbe-number (νd) 59
Electrical Properties
Dielectric Loss (tanδ) 0.010  20 ºC 1MHz
(tanδ) 0.019 100 ºC 1MHz
(tanδ)

0.049

200 ºC 1MHz
Dielectric Coefficient 6  20 ºC 1MHz
7 100 ºC 1MHz
7 200 ºC 1MHz
Volume Resistivity X1012Ω・m 4.1  20 ºC DC500V 1 minute
X1010Ω・m 0.4 100 ºC DC500V 1 minute
X107Ω・m 3.8 200 ºC DC500V 1 minute
*1
Indicate in weight reduction mg/cm2 per unit area when polished glass sample of 43.7 mm diameter (30cm2 on both sides) and 5mm in thickness was immersed in well stirred 80 °C 30% HNO3 aqueous solution for 50 hours.
*2
Indicate in weight reduction mg/cm2 per unit area when polished glass sample of 43.7mm diameter (30cm2 on both sides) and 5mm in thickness was immersed in well-stirred 80 °C. H2SO4: HNO3: H2O = 1:1:1 aqueous solution for 50 hours.
*3
Indicate in weight reduction mg/cm2 per unit area when polished glass sample of 43.7mm diameter (30cm2 on both sides) and 5mm in thickness was immersed in well-stirred 50 °C. 0.00N NaOH aqueous solution for 15 hours.

NIR Polarizer Glass CUPO®

It is polarizing glass (CUPO®) for near infrared light utilizing plasma absorption by copper fine particles. It is thin, achieves both high extinction ratio and low insertion loss, making it ideal as a component of small parts.

Features

  • Copper fine particle dispersed glass
  • High extinction ratio
  • Low insertion loss
  • High reliability

Applications

  • Optical isolator
  • Optical modulator
  • Wavelength selection switch

Specifications

Band O-band, E-band, S-band, C-band, L-band
Extinction Ratio > 35 [dB] (Measured distance 5mm)
> 50 [dB] (Measured distance 300mm)
Transmittnace (No AR coating) > 90 [%]
Thickness (Standard) 0.2 [mm]

Both sides, Single side coating can be made